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Investigation of silicon die crack for varying silicon die parameters and die attach materials

Bibliographic Details
Published in:Philippine Engineering Journal [eJournal] 41, 1 (2020).
Main Authors: Macaspac, Hannah Erika (Author), Callanga, Jennifer (Author), Dimagiba, Richard Raymond (Author), Mena, Manolo (Author)
Format: Article
Language:English
Subjects:
Die crack.
J-integral.
Small-outline transistor.
Online Access:Available for University of the Philippines Diliman. Click here