Investigation of silicon die crack for varying silicon die parameters and die attach materials

Demand for small sized, portable electronic devices continually increases until today. Compact electronics would mean a reduction in size of semiconductors that would translate to further shrinking of components inside of it such as the small outline diode (SOD) and the small outline transistor (SOT...

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Bibliografski detalji

Izdano u:	Philippine Engineering Journal [eJournal] 41, 1 (2020).
Glavni autori:	Macaspac, Hannah Erika (Autor), Callanga, Jennifer (Autor), Dimagiba, Richard Raymond (Autor), Mena, Manolo (Autor)
Format:	Članak
Jezik:	English
Teme:	Die crack. J-integral. Small-outline transistor.
Online pristup:	Available for University of the Philippines Diliman. Click here