Analysis of crack propagation under different die tilt configuration on a small outline transistor
In today's microelectronic industry, the increasing demand for miniaturization and high function integration poses a big challenge in maintaining the reliability of the package. It was found out that majority of the reliability problems can be attributed to thermal and mechanical loadings durin...
| Опубликовано в:: | Philippine Engineering Journal [eJournal] 41, 1 (2020). |
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| Главные авторы: | , , , |
| Формат: | Статья |
| Язык: | английский |
| Предметы: | |
| Online-ссылка: | Available for University of the Philippines Diliman. Click here |