Analysis of crack propagation under different die tilt configuration on a small outline transistor

Analysis of crack propagation under different die tilt configuration on a small outline transistor

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In today's microelectronic industry, the increasing demand for miniaturization and high function integration poses a big challenge in maintaining the reliability of the package. It was found out that majority of the reliability problems can be attributed to thermal and mechanical loadings durin...

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Bibliografske podrobnosti
izdano v:Philippine Engineering Journal [eJournal] 41, 1 (2020).
Main Authors: Callanga, Jennifer (Author), Macaspac, Hannah Erika (Author), Danao, Louis Angelo (Author), Mena, Manolo (Author)
Format: Article
Jezik:English
Teme:
Fracture mechanics.
ANSYS.
Crack propagation.
Online dostop:Available for University of the Philippines Diliman. Click here