Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Podrobná bibliografie
Vydáno v:Industrial engineering & management systems 2, 2 (2003 (D)).
Hlavní autor: Tien-Lung Sun
Další autoři: Chih-Cheng Tsai
Médium: Článek
Jazyk:English
Témata:
IC manufacturing.
Data mining tree.
Data visualization.
Parallel coordinates.
Decision tree.