Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Analysis of LPC data for wafer yield improvement using a combined data mining and visualization technique

Bibliographic Details
Published in:Industrial engineering & management systems 2, 2 (2003 (D)).
Main Author: Tien-Lung Sun
Other Authors: Chih-Cheng Tsai
Format: Article
Language:English
Subjects:
IC manufacturing.
Data mining tree.
Data visualization.
Parallel coordinates.
Decision tree.