Silicon wafer bonding technology for VLSI and MEMS applications

التفاصيل البيبلوغرافية
مؤلف مشترك:	INSPEC. EMIS Group
مؤلفون آخرون:	Iyer, Subramanian S. (المحرر), Auberton-Herve, Andre J. (المحرر)
التنسيق:	Electronic Resource
اللغة:	الإنجليزية
منشور في:	London, United Kingdom Institution of Engineering and Technology 2002.
الموضوعات:	Silicon-on-insulator technology. Integrated circuits > Very large scale integration. Microelectromechanical systems. Electronic books.
الوصول للمادة أونلاين:	Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy