Silicon wafer bonding technology for VLSI and MEMS applications

Detalles Bibliográficos
Autor Corporativo:	INSPEC. EMIS Group
Outros autores:	Iyer, Subramanian S. (Editor), Auberton-Herve, Andre J. (Editor)
Formato:	Electronic Resource
Idioma:	English
Publicado:	London, United Kingdom Institution of Engineering and Technology 2002.
Subjects:	Silicon-on-insulator technology. Integrated circuits > Very large scale integration. Microelectromechanical systems. Electronic books.
Acceso en liña:	Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy