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Silicon wafer bonding technology for VLSI and MEMS applications

Detalhes bibliográficos
Autor Corporativo: INSPEC. EMIS Group
Outros Autores: Iyer, Subramanian S. (Editor), Auberton-Herve, Andre J. (Editor)
Formato: Electronic Resource
Idioma:inglês
Publicado em: London, United Kingdom Institution of Engineering and Technology 2002.
Assuntos:
Silicon-on-insulator technology.
Integrated circuits > Very large scale integration.
Microelectromechanical systems.
Electronic books.
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