Silicon wafer bonding technology for VLSI and MEMS applications

Silicon wafer bonding technology for VLSI and MEMS applications

Dades bibliogràfiques
Autor corporatiu: INSPEC. EMIS Group
Altres autors: Iyer, Subramanian S. (Editor), Auberton-Herve, Andre J. (Editor)
Format: Electronic Resource
Idioma:English
Publicat: London, United Kingdom Institution of Engineering and Technology 2002.
Matèries:
Silicon-on-insulator technology.
Integrated circuits > Very large scale integration.
Microelectromechanical systems.
Electronic books.
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