MEMS packaging

The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aeros...

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Bibliographic Details
Other Authors:	Hsu, Tai-Ran (Editor)
Format:	Electronic Resource
Language:	English
Published:	London, United Kingdom Institution of Engineering and Technology 2004.
Subjects:	Microelectromechanical systems. Microelectronic packaging. Electronic books.
Online Access:	Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy