MEMS packaging
The book reviews developments in the following fields: fundamentals of MEMS packaging; joining and bonding technologies; sealing technology; microsystem packaging; automated microassembly; design for test; MEMS packaging in the life sciences; RF and optical packaging in telecommunications; and aeros...
| अन्य लेखक: | |
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| स्वरूप: | Electronic Resource |
| भाषा: | English |
| प्रकाशित: |
London, United Kingdom
Institution of Engineering and Technology
2004.
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| विषय: | |
| ऑनलाइन पहुंच: | Available for University of the Philippines Diliman via IET Digital Library. Click here to access Also available remotely for University of the Philippines Diliman via IET Digital Library. Click here to access thru EZproxy |