Delamination in plastic packages
Delamination or the disbonding of the plastic moulding compound from various surfaces and interfaces in a packaged integrated circuit is a major cause of reliability failures. This paper reviews the causes of the said disbonding, the types of reliability failures that may be induced as well as vario...
| Publié dans: | Philippine Engineering Journal 18, 1 (1997(Je)). |
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| Auteur principal: | |
| Format: | Article |
| Langue: | English |
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| Accès en ligne: | Also available online for University of the Philippines Diliman. Click here |