Delamination in plastic packages

Delamination in plastic packages

Delamination or the disbonding of the plastic moulding compound from various surfaces and interfaces in a packaged integrated circuit is a major cause of reliability failures. This paper reviews the causes of the said disbonding, the types of reliability failures that may be induced as well as vario...

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Bibliographic Details
Published in:Philippine Engineering Journal 18, 1 (1997(Je)).
Main Author: Mena, Manolo G.
Format: Article
Language:English
Subjects:
Composite materials > Delamination.
Plastic integrated circuit packaging.
Online Access:Also available online for University of the Philippines Diliman. Click here