Thermal management in electronic packages

Packaging of an integrated circuit not only involves the physical isolation of the delicate integrated circuit or "silicon chip" from the environment but also the provision of a thermal conduction path to allow the heat generated during the operation of the chip to be dissipated to the env...

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Bibliografische gegevens

Gepubliceerd in:	Philippine Engineering Journal 18, 1 (1997(Je)).
Hoofdauteur:	Mena, Manolo G.
Formaat:	Artikel
Taal:	English
Onderwerpen:	Electronic packaging thermal management. Environmental management. Thermal management of electronics. Volumetric power densities.
Online toegang:	Also available online for University of the Philippines Diliman. Click here