Thermal management in electronic packages

Packaging of an integrated circuit not only involves the physical isolation of the delicate integrated circuit or "silicon chip" from the environment but also the provision of a thermal conduction path to allow the heat generated during the operation of the chip to be dissipated to the env...

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Bibliographic Details

Published in:	Philippine Engineering Journal 18, 1 (1997(Je)).
Main Author:	Mena, Manolo G.
Format:	Article
Language:	English
Subjects:	Electronic packaging thermal management. Environmental management. Thermal management of electronics. Volumetric power densities.
Online Access:	Also available online for University of the Philippines Diliman. Click here