Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages
This project aims to solve one of the reliability limitations facing the semiconductor and board mount industry today. Following Moore's law stating that the transistor density of an IC will double every 18 months, translates to an increased power dissipation two folds. With this, an alternativ...
| 發表在: | Philippine Engineering Journal 30, 2(3 copies) (2009(D)). |
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| 格式: | Article |
| 語言: | English |
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| 在線閱讀: | Also available online for University of the Philippines Diliman. Click here |