Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages

Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages

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This project aims to solve one of the reliability limitations facing the semiconductor and board mount industry today. Following Moore's law stating that the transistor density of an IC will double every 18 months, translates to an increased power dissipation two folds. With this, an alternativ...

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Bibliographic Details
Published in:Philippine Engineering Journal 30, 2(3 copies) (2009(D)).
Main Author: Clemente, Richard Q.
Other Authors: Basilia, Blessie A.
Format: Article
Language:English
Subjects:
Quad Flat No-lead.
SnAgCu(SAC).
Multi-walled carbon nanotube (MWCNT, CNT).
Finite Element Analysis (FEA).
Online Access:Also available online for University of the Philippines Diliman. Click here