Board level solder joint reliability and finite element modeling of carbon nanotube filled leadfree solder alloy on QFN packages

Bibliographic Details
Published in:	Philippine Engineering Journal 30, 2(3 copies) (2009(D)).
Main Author:	Clemente, Richard Q.
Other Authors:	Basilia, Blessie A.
Format:	Article
Language:	English
Subjects:	Quad Flat No-lead. SnAgCu(SAC). Multi-walled carbon nanotube (MWCNT, CNT). Finite Element Analysis (FEA).
Online Access:	Also available online for University of the Philippines Diliman. Click here