Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Λεπτομέρειες βιβλιογραφικής εγγραφής
Άλλοι συγγραφείς: Cohn, Charles, Harper, Charles A.
Μορφή: Βιβλίο
Γλώσσα:English
Έκδοση: New York McGraw-Hill c2005.
Θέματα:
Microelectronic packaging.
Integrated circuits > Fault tolerance.