Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Bibliographic Details
Other Authors: Cohn, Charles, Harper, Charles A.
Resource Type: Book
Language:English
Published: New York McGraw-Hill c2005.
Subjects:
Microelectronic packaging.
Integrated circuits > Fault tolerance.

College of Engineering Library II (UP Diliman)

Accession # Call # Volume/Part# Copy # Collection Circulation Type Circulation Status
E-36282 TK 7870.15 / F35 2005 Regular Circulation On-Shelf