Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Opis bibliograficzny
Kolejni autorzy: Cohn, Charles, Harper, Charles A.
Format: Książka
Język:English
Wydane: New York McGraw-Hill c2005.
Hasła przedmiotowe:
Microelectronic packaging.
Integrated circuits > Fault tolerance.