Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Failure-free integrated circuit packages systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Библиографические подробности
Другие авторы: Cohn, Charles, Harper, Charles A.
Формат: ‌
Язык:English
Опубликовано: New York McGraw-Hill c2005.
Предметы:
Microelectronic packaging.
Integrated circuits > Fault tolerance.