An electromigration and thermal model of power wires for a priori high-level reliability prediction.

In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap...

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Veröffentlicht in:	IEEE Transactions on VLSI systems 12, 4 (2004).
1. Verfasser:	Casu, M.R
Format:	Artikel
Sprache:	Englisch
Schlagworte:	VLSI. A priori high-level reliability prediction. Chip area power supply interconnect prediction. Complex systems-on-chip. Electromigration model. Electrothermal model. Power wires. Power-distribution. Self-consistent roadmap projections. Self-heating. Statistical current model.