An electromigration and thermal model of power wires for a priori high-level reliability prediction.

An electromigration and thermal model of power wires for a priori high-level reliability prediction.

In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap...

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Detalhes bibliográficos
Publicado no:IEEE Transactions on VLSI systems 12, 4 (2004).
Autor principal: Casu, M.R
Formato: Artigo
Idioma:English
Assuntos:
VLSI.
A priori high-level reliability prediction.
Chip area power supply interconnect prediction.
Complex systems-on-chip.
Electromigration model.
Electrothermal model.
Power wires.
Power-distribution.
Self-consistent roadmap projections.
Self-heating.
Statistical current model.