Advanced MEMS packaging

Bibliografske podrobnosti
Drugi avtorji:	Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
Format:	Knjiga
Jezik:	English
Izdano:	New York McGraw-Hill [2010]
Teme:	Microelectromechanical systems. Microelectronic packaging.
Online dostop:	Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access