Advanced MEMS packaging

Podrobná bibliografie
Další autoři:	Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
Médium:	Kniha
Jazyk:	English
Vydáno:	New York McGraw-Hill [2010]
Témata:	Microelectromechanical systems. Microelectronic packaging.
On-line přístup:	Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access