Advanced MEMS packaging

Advanced MEMS packaging

Mostrar todas as versões (2)
Detalhes bibliográficos
Outros Autores: Lau, John H. (Editor), Lee, Cheng Kuo (Editor), Premachandran, C. S. (Editor), Aibin, Yu (Editor)
Formato: Livro
Idioma:English
Publicado em: New York McGraw-Hill [2010]
Assuntos:
Microelectromechanical systems.
Microelectronic packaging.
Acesso em linha:Also available online for University of the Philippines Diliman via McGraw-Hill Access Engineering. Click here to access