Packages go vertical.
Stacking different chips in a package tucks a complete system into implantable devices like hearing aids. In this paper, the author describes how cell phones and wearable computers could be next
| में प्रकाशित: | IEEE spectrum 38, 8 (2001). |
|---|---|
| मुख्य लेखक: | |
| स्वरूप: | लेख |
| भाषा: | English |
| विषय: |