Moore's law meets its match (system-on-package).

This paper describes the system-on-package (SOP) approach to miniaturization developed at the Microsystems Packaging Research Center at the Georgia Institute of Technology. Representing a radically different approach to systems, SOP combines IC with micrometer-scale thin film versions of discrete co...

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ग्रंथसूची विवरण
में प्रकाशित:IEEE spectrum 43, 6 (2006).
मुख्य लेखक: Tummala, R.R
स्वरूप: लेख
भाषा:English
विषय: