Moore's law meets its match (system-on-package).

This paper describes the system-on-package (SOP) approach to miniaturization developed at the Microsystems Packaging Research Center at the Georgia Institute of Technology. Representing a radically different approach to systems, SOP combines IC with micrometer-scale thin film versions of discrete co...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	IEEE spectrum 43, 6 (2006).
1. Verfasser:	Tummala, R.R
Format:	Artikel
Sprache:	English
Schlagworte:	Georgia Institute of Technology. IC. Microsystems Packaging Research Center. SOP approach. Discrete components. Handhelds. Megafunction electronics. Micrometer-scale thin-film versions. System miniaturization. System-on-package approach. Transistors.