Minimization of the mechanical-stress-induced inaccuracy in bandgap voltage references.
This paper shows a systematic approach to calculate and to minimize mechanical-stress-related problems in bandgap voltage references. Mechanical stress is the main cause of long-term drift and packaging-induced inaccuracy in bandgap voltage references. Especially, low-cost epoxy packaging can cause...
| Published in: | IEEE Journal of solid state circuits 38, 7 (2003). |
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| Main Author: | |
| Format: | Article |
| Language: | English |
| Subjects: |