Microelectronic packaging for retinal prostheses.

An innovative parylene-based high-density chip-level integrated interconnect (CL-I2) packaging system for retinal implants id discussed. The implications of this CL-I2 technology for retinal prosthesis packaging effort are far-reaching. This technology obviates the need for a technician to create el...

Descrición completa

Detalles Bibliográficos

Publicado en:	IEEE Engineering in medicine and biology magazine 24, 5 (2005).
Autor Principal:	Rodger, D.C
Formato:	Artigo
Idioma:	English
Subjects:	High-density electrode arrays. Innovative parylene-based high-density chip-level integrated interconnect packaging system. Microelectronic packaging. Microfabrication. Photolithography. Retinal implants. Retinal prostheses.