Microelectronic packaging for retinal prostheses.

Microelectronic packaging for retinal prostheses.

An innovative parylene-based high-density chip-level integrated interconnect (CL-I2) packaging system for retinal implants id discussed. The implications of this CL-I2 technology for retinal prosthesis packaging effort are far-reaching. This technology obviates the need for a technician to create el...

Szczegółowa specyfikacja

Opis bibliograficzny
Wydane w:IEEE Engineering in medicine and biology magazine 24, 5 (2005).
1. autor: Rodger, D.C
Format: Artykuł
Język:English
Hasła przedmiotowe:
High-density electrode arrays.
Innovative parylene-based high-density chip-level integrated interconnect packaging system.
Microelectronic packaging.
Microfabrication.
Photolithography.
Retinal implants.
Retinal prostheses.