Microelectronic packaging for retinal prostheses.
An innovative parylene-based high-density chip-level integrated interconnect (CL-I2) packaging system for retinal implants id discussed. The implications of this CL-I2 technology for retinal prosthesis packaging effort are far-reaching. This technology obviates the need for a technician to create el...
| প্রকাশিত: | IEEE Engineering in medicine and biology magazine 24, 5 (2005). |
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| প্রধান লেখক: | |
| বিন্যাস: | প্রবন্ধ |
| ভাষা: | English |
| বিষয়গুলি: |