$Understanding the effect of surface flaws on fracture of silicon die$
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Understanding the effect of surface flaws on fracture of silicon die

Détails bibliographiques
Auteur principal:	Punzalan, Jaime C.
Format:	Thèse
Langue:	English
Publié:	2003.
Sujets:	Fracture mechanics. Fractography. Materials > Cracking > Measurement. Semiconductor wafers. Silicon crystals.