$Understanding the effect of surface flaws on fracture of silicon die$
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Understanding the effect of surface flaws on fracture of silicon die

Dettagli Bibliografici
Autore principale:	Punzalan, Jaime C.
Natura:	Tesi
Lingua:	English
Pubblicazione:	2003.
Soggetti:	Fracture mechanics. Fractography. Materials > Cracking > Measurement. Semiconductor wafers. Silicon crystals.