Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Detaylı Bibliyografya
Diğer Yazarlar: Pecht, Michael
Materyal Türü: Kitap
Dil:English
Baskı/Yayın Bilgisi: New York Wiley c1994.
Konular:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.