Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Bibliografische gegevens
Andere auteurs: Pecht, Michael
Formaat: Boek
Taal:English
Gepubliceerd in: New York Wiley c1994.
Onderwerpen:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.