Quality conformance and qualification of microelectronic packages and interconnects

Quality conformance and qualification of microelectronic packages and interconnects

Détails bibliographiques
Autres auteurs: Pecht, Michael
Format: Livre
Langue:English
Publié: New York Wiley c1994.
Sujets:
Electronic packaging > Defects.
Electronic packaging > Quality control.
Electronic packaging > Testing.
Quality assurance.