Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Opis bibliograficzny
1. autor:	Pecht, Michael
Format:	Książka
Język:	angielski
Wydane:	New York Wiley c1994.
Hasła przedmiotowe:	Electronic packaging > Design. Hybrid integrated circuits > Design and construction. Multichip modules (Microelectronics) > Design and construction.