Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Bibliografiset tiedot
Päätekijä: Pecht, Michael
Aineistotyyppi: Kirja
Kieli:English
Julkaistu: New York Wiley c1994.
Aiheet:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.