Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

ग्रंथसूची विवरण
मुख्य लेखक: Pecht, Michael
स्वरूप: पुस्तक
भाषा:English
प्रकाशित: New York Wiley c1994.
विषय:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.