Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Dades bibliogràfiques
Autor principal:	Pecht, Michael
Format:	Llibre
Idioma:	anglès
Publicat:	New York Wiley c1994.
Matèries:	Electronic packaging > Design. Hybrid integrated circuits > Design and construction. Multichip modules (Microelectronics) > Design and construction.