Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines a focus on reliability

Podrobná bibliografie
Hlavní autor: Pecht, Michael
Médium: Kniha
Jazyk:English
Vydáno: New York Wiley c1994.
Témata:
Electronic packaging > Design.
Hybrid integrated circuits > Design and construction.
Multichip modules (Microelectronics) > Design and construction.