Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Detalhes bibliográficos
Outros Autores:	Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Formato:	Livro
Idioma:	English
Publicado em:	New York Wiley c1995.
Assuntos:	Microelectronic packaging > Materials. Microencapsulation. Plastics in packaging.