Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Plastic-encapsulated microelectronics materials, processes, quality, reliability, and applications

Detalhes bibliográficos
Outros Autores: Hakim, Edward B., Nguyen, Luu T., Pecht, Michael
Formato: Livro
Idioma:English
Publicado em: New York Wiley c1995.
Assuntos:
Microelectronic packaging > Materials.
Microencapsulation.
Plastics in packaging.