Kansikuva

3D microelectronic packaging from architectures to applications

Bibliografiset tiedot
Muut tekijät: Li, Yan (Toimittaja), Goyal, Deepak (Toimittaja)
Aineistotyyppi: Electronic Resource
Kieli:englanti
Julkaistu: Singapore Springer [2021]
Aiheet:
Biotechnology.
Electronics.
Electronics > Materials.
Microelectronics.
Microelectronics > Packaging.
Nanotechnology.
Electronic circuits.
Optical materials.
Electronic books.
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Available for University of the Philippines System via SpringerLink. Click here to access