3D microelectronic packaging from architectures to applications

3D microelectronic packaging from architectures to applications

Podrobná bibliografie
Další autoři: Li, Yan (Editor), Goyal, Deepak (Editor)
Médium: Electronic Resource
Jazyk:English
Vydáno: Singapore Springer [2021]
Témata:
Biotechnology.
Electronics.
Electronics > Materials.
Microelectronics.
Microelectronics > Packaging.
Nanotechnology.
Electronic circuits.
Optical materials.
Electronic books.
On-line přístup:Also available remotely for the University of the Philippines System via SpringerLink. Click here to access thru EZproxy
Available for University of the Philippines System via SpringerLink. Click here to access