Design to manufacture of complex building envelopes single layer envelopes: mullion-transom systems + 3D printed metal nodes
| المؤلف الرئيسي: | |
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| مؤلف مشترك: | |
| التنسيق: | Electronic Resource |
| اللغة: | English |
| منشور في: |
Wiesbaden
Springer
[2020]
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| الموضوعات: | |
| الوصول للمادة أونلاين: | Available for University of the Philippines Diliman via SpringerLink. Click here to access Also available remotely for University of the Philippines Diliman via SpringerLink. Click here to access thru EZproxy |