Journal of Electronic Packaging [ejournal].

Podrobná bibliografie
Korporativní autor:	ASME
Médium:	Continuing Resource
Jazyk:	angličtina
Vydáno:	United States The American Society of Mechanical Engineering 1989-2022
Témata:	Computer Science Applications. Electrical and Electronic Engineering. Electronic, Optical and Magnetic Materials. Mechanics of Materials.
On-line přístup:	Available for University of the Philippines Diliman via ASME. Click here to access