Journal of Electronic Packaging [ejournal].

Dades bibliogràfiques
Autor corporatiu:	ASME
Format:	Continuing Resource
Idioma:	English
Publicat:	United States The American Society of Mechanical Engineering 1989-2022
Matèries:	Computer Science Applications. Electrical and Electronic Engineering. Electronic, Optical and Magnetic Materials. Mechanics of Materials.
Accés en línia:	Available for University of the Philippines Diliman via ASME. Click here to access